1206 Multilayer Chip Varistor SV1206N220G0A For Motherboard Notebook

3000PCS
MOQ
Negotiable
Price
1206 Multilayer Chip Varistor SV1206N220G0A For Motherboard Notebook
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Features
Specifications
Component Name: Multilayer Chip Varistor
Component Package: SMD1206
Maximum DC Operating Voltage: 22V
Vv (Min.): 26.4V
Vv (Max.): 33V
Maximum Peak Current Across The Varistor: 72V
Maximum Peak Current: 100A
Maximum AC Operating Voltage: 17V
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1206 Multilayer Chip Varistor

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Notebook Multilayer Chip Varistor

Basic Infomation
Place of Origin: Shenzhen Guangdong China
Brand Name: SOCAY
Certification: REACH RoHS ISO
Model Number: SV1206N220G0A
Payment & Shipping Terms
Delivery Time: 5-8 work days
Product Description

1206 Multilayer Chip Varistor SV1206N220G0A Application for Mother Board, Notebook

 
Multilayer Chip Varistor DATASHEET:  SV1206N220G0A_v209.1.pdf
 
 
Description:
The Multilayer Chip Varistor SV1206N220G0A is based on Multilayer fabrication technology. These components are designed to suppress a variety of transient events, including those specified in IEC 61000-4-2 or other standards used for Electromagnetic Compliance (EMC). The SV1206N220G0A is typically applied to protect integrated circuits and other components at the circuit board level. It can operate over a wider temperature range than zener diodes.
 
 
Multilayer Chip Varistor Electrical Characteristics (25±5℃):

Symbol Minimum Typical Maximum Units
VRMS 17 V
VDC 22 V
VV 26.4 33 V
VC 72 V
Imax 100 A
Wmax 0.5 W

VRMS - Maximum AC operating voltage the varistor can maintain and not exceed 10μA leakage current.

VDC - Maximum DC operating voltage the varistor can maintain and not exceed 10μA leakage current.

VV - Voltage across the device measure at 1mA DC current.

Equivalent to VB “breakdown voltage”.

VC - Maximum peak current across the varistor with 8/20μs waveform and 5A pulse current.

Imax - Maximum peak current which may be applied with 8/20μs waveform without device failure.

Wmax - Maximum energy which may be dissipated with the 10/1000μs waveform without device failure.

 

 

 
 
Multilayer Chip Varistor Features:

  • Rectangle, sizes serialization for hybrid integrated circuit or printed circuit surface mount components
  • There are many side electrode lead-out material, particularly suitable for surface mount technology for solderability and resistance to soldering heat of the stringent requirements
  • Fast response (<1ns)
  • Low leakage current, low clamping voltage
  • Suitable for reflow, wave soldering and hot air hand soldering

 
 
Multilayer Chip Varistor Applications:

  • Application for Mother Board, Notebook, Cellular Phone, PDA, handheld device, DSC, DV, Scanner, and Set- Top Box…etc.
  • Suitable for Push-Button, Power Line and Low Frequency single line over-voltage protect.

 
 
 
Multilayer Chip Varistor Construction & Dimensions:
1206 Multilayer Chip Varistor SV1206N220G0A For Motherboard Notebook 0

Size EIA (EIAJ) Length (L) Width (W) Thickness (T)
  Inches Millimeters Inches Millimeters Inches Millimeters
1206 (3216) 0.126±0.012 3.20±0.30 0.063±0.012 1.60±0.30 0.071 Max 1.80 Max

 

 

 

 
 
Multilayer Chip Varistor IR Soldering:

 

Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and solder liquidus times. Make sure that the element is not subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal gradient. During the soldering process, pre-heating to within 100 degrees of the solder peak temperature is essential to minimize thermal shock.

 
 

 

 

Soldering Recommendations:

1206 Multilayer Chip Varistor SV1206N220G0A For Motherboard Notebook 1

  • Preheat
    • The temperature rising speed is suggested to be 2~4 ℃ /s
    • Appropriate preheat time will be from 60 to 120 seconds.
  • Heating
    • Careful about sudden rise in temperture as it may worser the solder ability.
    • Set the peal temperature in the range from 215 ℃ to 225 ℃.
  • Cooling
    • Careful about slow cooling as it may cause the position shift of component.

 

 


 
Multilayer Chip Varistor Environmental & Reliability Testing:

Characteristic Test method and description
High Temperature Storage The specimen shall be subjected to125±2℃ for 1000±2 hours in a thermostatic bath without load and then stored at room temperature and humidity for 1 to 2 hours. The change of varistor voltage shall be within 10%.
Temperature Cycle The temperature cycle of specified temperature shall be repeated five times and then stored at room temperature and humidity for one two hours. The change of varistor voltage shall be within 10% and mechanical damage shall be examined. Step Temperture Period
    1 -40±3℃ 30min±3
    2 Room Temperature 1~2hours
    3 125±2℃ 30min±3
    4 Room Temperature 1~2hours
High Temperature Load After being continuously applied the maximum allowable voltage at 85℃ for 1000hours, the specimen shall be stored at room temperature and humidity for one or hours, the change of varistor voltage shall be within 10%.

Damp Heat Load/

Humidity Load

The specimen should be subjected to 40℃,90 to 95%RH environment, and the maximum allowable voltage applied for 1000 hours, then stored at room temperature and humidity for one or two hours. The change of varistor voltage shall be within 10%.
Low Temperature Storage The specimen should be subjected to -40℃, without load for 1000 hours and then stored at room temperature for one two hours. The change of varistor voltage shall be within 10%.

 
 
 
 
Quantity of Products in The Taping Package:

SIZE EIA (EIAJ)

1206

(3216)

Standard Packing Quantity (PCS / reel) 3,000

 

 

1206 Multilayer Chip Varistor SV1206N220G0A For Motherboard Notebook 2

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